Micron Opens Second AI Memory Packaging Plant in Taichung
Micron has commenced operations at its second Advanced Assembly and Test plant in Taichung, Taiwan, to expand production of high-bandwidth memory (HBM) for AI applications. The company reports that customer bookings for its HBM production facilities are fully committed through 2027.
Micron's expansion in Taichung, a primary hub for its HBM back-end processing, directly addresses the strong reported demand for AI memory. The new AATT2 plant is intended to enhance the company's capacity for HBM, reinforcing Taiwan's role in the global semiconductor supply chain for advanced packaging and testing.
The chairman's statement that HBM production facilities are fully booked through 2027 provides a concrete measure of current market demand for AI-specific memory. This indicates that the industry is actively securing foundational hardware to support AI development, with extended lead times for these essential components.
Micron's broader investment strategy, which includes plans for an advanced HBM packaging plant in Singapore by 2027 and other expansions across Taiwan, suggests a sustained effort to scale HBM production. This multi-location approach could offer some resilience in meeting future AI market demands, particularly as the company also plans to introduce advanced extreme ultraviolet (EUV) processes at its Taoyuan Fab 11 by 2028.
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