AMD's Lisa Su Meets Samsung, Eyes Broader Tie-Up in Physical AI

The meeting suggests AMD is looking to deepen its strategic engagement with Samsung beyond existing high-bandwidth memory (HBM) supply. Discussions around HBM4 for AMD's Instinct MI455X chip indicate an intent to secure advanced memory for future AI accelerators, building on Samsung's prior selection as an initial supplier for the MI455X after an earlier meeting in March.

A notable development is the reported consideration of entrusting chip production to Samsung's foundry business. This would expand the relationship from memory supply to core chip manufacturing, potentially leveraging Samsung's integrated capabilities across memory, foundry services, and advanced packaging. Su's earlier comments at AMD Gamer Day, where she hinted at cooperation beyond memory and expressed interest in long-term relationships, align with this broader scope.

The companies also exchanged views on extending cooperation into physical AI, an area AMD is aggressively entering after its acquisition of World Labs for $8.2 billion (about 11 trillion won) late last month. Samsung's own development of next-generation robot chip solutions, which combine memory, image sensors, foundry services, and advanced packaging, along with its Device eXperience (DX) division's work on robotics, presents a potential synergy for developing integrated hardware and AI models for physical applications. This suggests a move towards more comprehensive, multi-faceted partnerships in the evolving AI landscape, as Su stated the companies "will work together in a variety of areas going forward."