《TAIPEI TIMES》Chiayi Science Park signaling Phase III development

TSMC’s planned expansion in Chiayi, adding five advanced packaging plants for a total of 10, cements Taiwan’s lead in a critical semiconductor segment. The development directly responds to robust demand for high-performance computing chips, particularly from AI leaders. The Chiayi park aims to integrate with other science parks, forming a comprehensive AI and semiconductor corridor across Taiwan.

The expansion strengthens Taiwan’s position against competitors like South Korea and the US in advanced packaging. While TSMC diversifies investments globally, its core advanced packaging capacity remains concentrated in Taiwan. The development ensures continued dominance in a technology vital for high-end AI chips, benefiting Taiwan’s supply chain and engineering talent.

The real test for this expansion is the timely completion of all three Phase II facilities by 2031 amidst potential construction and talent challenges. If TSMC meets this goal, it will further entrench its manufacturing advantage. The public comment period for Phase III, estimated at 198.65 hectares, must also proceed smoothly to maintain momentum.