FMS 2026 | Longsys Chief Scientist Jian Chen Highlights the Storage Foundry Model for Edge AI
Longsys Chief Scientist Dr. Jian Chen introduced the company’s Storage Foundry Model at FMS 2026, addressing the evolving storage demands driven by the shift of AI from cloud to edge computing. The model emphasizes full-stack engineering across eight areas, from chip design to mass production, to enable customized solutions for diverse edge AI applications. Dr. Chen highlighted three innovations: HLCacheTM for mobile AI, iSATM + AISSDTM for AI PCs, and AIDIMMTM for AI BOX and edge AI systems, all designed to overcome challenges like high DRAM costs and limited memory capacity. Longsys aims to foster a collaborative ecosystem, dubbed “Collabovate,” to accelerate tailored edge AI deployments by integrating hardware, firmware, and system-level optimization with partners. This strategy seeks to navigate the fragmented edge AI landscape and unlock new possibilities for intelligent computing.
Longsys’ introduction of the Storage Foundry Model and its associated innovations marks a significant development for Asia’s burgeoning edge AI ecosystem. As AI processing increasingly moves from centralized cloud infrastructure to local devices, the demand for specialized, high-performance, and cost-effective storage solutions is escalating across the region. Asian markets, particularly in manufacturing, smart cities, and consumer electronics, are at the forefront of edge AI adoption, making Longsys’ tailored approach highly relevant. The emphasis on full-stack engineering and cross-domain optimization reflects a growing trend among Asian semiconductor and memory firms to move beyond standardized components, offering integrated solutions that address specific industry pain points. This strategic shift positions Longsys to capture a larger share of the fragmented but rapidly expanding edge AI market in Asia.
The “Collabovate” initiative further underscores the collaborative nature required to scale edge AI in Asia. Given the diverse architectures, AI models, and device forms prevalent across different Asian economies, a single-product approach is insufficient. Longsys’ open technology capabilities and ecosystem collaboration aim to accelerate development cycles and lower deployment barriers for partners across chips, devices, and AI platforms. This collaborative model is crucial for fostering innovation and interoperability within Asia’s competitive tech landscape, potentially leading to faster market penetration for edge AI solutions in sectors ranging from industrial automation to smart consumer devices. The focus on reducing DRAM costs and improving memory bandwidth directly addresses key challenges faced by developers and manufacturers in the region, making edge AI more accessible and economically viable.
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