LG Innotek Showcases Next‐Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC
LG Innotek is showcasing its next-generation semiconductor package substrate technologies at the 2026 Electronic Components and Technology Conference (ECTC) in Orlando, Florida. The company is presenting large FC-BGA substrates designed for AI applications, featuring innovative chip-embedding technology that reduces power loss by approximately 25%. Additionally, LG Innotek is highlighting its RF-SiP substrates for 5G communications, which utilize pioneering Cu-Post technology to enable thinner, high-performance smartphones. This marks LG Innotek’s first participation in ECTC, underscoring its ambition to expand its package solution business to 2.0 billion USD by 2030.
LG Innotek’s debut at ECTC with advanced semiconductor substrate technologies signals a strategic push into high-growth areas like AI and 5G, crucial for Asia’s tech ecosystem. The development of larger FC-BGA substrates with chip-embedding technology directly addresses the escalating demands of AI workloads, which require higher performance and greater power efficiency. This innovation positions LG Innotek as a key enabler for the next generation of AI hardware, potentially driving further advancements in data centers and edge computing across the region.
The introduction of RF-SiP substrates with Cu-Post technology also highlights a significant leap in mobile communication component design. By enabling thinner, more integrated smartphone components, LG Innotek is responding to the continuous consumer demand for sleeker devices with enhanced functionality. This technological advancement could influence product roadmaps for major Asian smartphone manufacturers, reinforcing the region’s dominance in mobile technology innovation and manufacturing. The company’s ambitious 2030 revenue target for its package solution business underscores the increasing strategic importance of semiconductor packaging in the global tech supply chain.
